System with response to cosmic ray detection

ABSTRACT

In some embodiments, a system includes a cosmic ray detector to detect cosmic rays and to generate cosmic ray detection signals indicative of the detected cosmic rays. The system also includes first circuitry to receive input signals and to produce output signals, and wherein the first circuitry speculates that the cosmic ray detector will not detect cosmic rays, but in response to the cosmic ray detection signals, the first circuitry re-performs at least some operations. Other embodiments are described and claimed.

RELATED APPLICATION

This application is filed the same day as an application entitled“Cosmic Ray Detectors for Integrated Circuit Chips” with the sameinventor (docket number 42P20046). Other than the Related Applicationand Technical Field sections, the two applications have identicalspecifications and figures, but different claims.

BACKGROUND

1. Technical Field

The present inventions relate to integrated circuit chips that respondsto detection of a cosmic ray and to related systems and cosmic raydetectors.

2. Background Art

The normal background radiation environment on the surface of the earthhas ionizing components that sometimes affects the reliability ofsemiconductor integrated circuit chips, such as memory chips used incomputers. If an intruding particle is near a p-n junction in the chip,it may induce a soft error, or single-event upset which can causesignals to change voltage and, accordingly, bits of data to changevoltage value. Excess electron-hole pairs may be generated in the wakeof the penetrating particle. The field in the neighborhood of the p-njunction, if sufficiently strong, separates these electrons and holesbefore they recombine, and sweeps the excess carriers of the appropriatesign to a nearby device contact. A random signal may be registered ifthis collected charge exceeds a critical threshold value.

Cosmic particles in the form of neutrons or protons can collide randomlywith silicon nuclei in the chip and fragment some of them, producingalpha-particles and other secondary particles, including the recoilingnucleus. These can travel in all directions with energies which can bequite high (though of course less than the incoming nucleon energy).Alpha-particle tracts so produced can sometimes extend a hundred micronsthrough the silicon. The track of an ionizing particle may extend afraction of a micron to many microns through the chip volume ofinterest, generating in its wake electron-hole pairs at a rate of onepair per 3.6-eV (electron volts) loss of energy. A typical track mightrepresent a million pairs of holes and electrons.

Cosmic ray induced computer crashes have occurred and are expected toincrease with frequency as devices (for example, transistors) decreasein size in chips. This problem is projected to become a major limiter ofcomputer reliability in the next decade.

Various approaches have been suggested to eliminate or reduce the numberof soft errors due to cosmic ray interactions in chips. None of theseapproaches is completely successful, particularly as device sizecontinues to decrease.

Another approach is to accept that some soft errors will happen and todesign memory and logic circuitry to include redundancy in allcalculations. This approach involves more gates and enough spatialseparation between contributing redundant elements to avoid mutual softerrors from the same cosmic ray. This approach is not practical for manychips.

BRIEF DESCRIPTION OF THE DRAWINGS

The inventions will be understood more fully from the detaileddescription given below and from the accompanying drawings ofembodiments of the inventions which, however, should not be taken tolimit the inventions to the specific embodiments described, but are forexplanation and understanding only.

FIG. 1 is a schematic block diagram representation of a system includinga chip having circuitry and a cosmic ray detector according to someembodiments of the inventions.

FIGS. 2 and 3 are each a schematic block diagram representation of thecircuitry in the chip of FIG. 1 according to some embodiments of theinventions.

FIGS. 4 and 5 are each a schematic block diagram representation of achip according to some embodiments of the inventions.

FIG. 6 is a system with two chips according to some embodiments of theinventions.

FIGS. 7 and 8 are each a schematic block diagram representation of achip according to some embodiments of the inventions.

FIGS. 9 and 10 are each a schematic block diagram representation of asystem including a chip and three cosmic ray detectors according to someembodiments of the inventions.

FIG. 11 is a schematic block diagram representation of a systemincluding chips and a cosmic ray detector according to some embodimentsof the inventions.

FIG. 12 is a schematic block diagram representation of a systemincluding a chip and three cosmic ray detectors according to someembodiments of the inventions.

FIGS. 13 and 14 are each a schematic block diagram representation of across-sectional side view of a chip including two cosmic ray detectorsaccording to some embodiments of the inventions.

FIG. 15 is a schematic block diagram representation of a cross-sectionalside view of a chip and a package including two cosmic ray detectorsaccording to some embodiments of the inventions.

FIGS. 16, 17, and 18 are each a schematic block diagram representationof a cross-sectional side view of a chip including a cosmic ray detectoraccording to some embodiments of the inventions.

FIG. 19 is a schematic block diagram representation of a cross-sectionalside view of a chip and a package including a cosmic ray detectoraccording to some embodiments of the inventions.

FIG. 20 is a schematic block diagram representation of a cosmic raydetector, current measuring circuitry, and an amplifier accordingly tosome embodiments of the inventions.

FIG. 21 is a schematic block diagram representation of a cross-sectionalside view of a chip including a cosmic ray detector according to someembodiments of the inventions.

FIGS. 22 and 23 are each a schematic block diagram representation of achip associated with cosmic ray detectors according to some embodimentsof the inventions.

FIGS. 24 and 25 are each a schematic block diagram representation ofcircuits that may be used according to some embodiments of theinventions.

DETAILED DESCRIPTION

A. Examples of Chips and Systems

Referring to FIG. 1, a chip 20 includes circuitry 24 which receivesinput signals on conductors 22 and provides output signals to outputconductors 28. Circuitry 24 may include any of a wide variety ofcircuits and may perform any of a wide variety of functions. A cosmicray detector 26 detects at least some cosmic rays that enter chip 20.Cosmic ray detector 26 provides to circuitry 24 an indication of thedetection of a cosmic ray. The cosmic ray detection signal may beindicated in various ways. For example, a cosmic ray detection signalmay be a logical high voltage on a conductor from cosmic ray detector 26to circuitry 24, while a logical low voltage on the same conductor doesnot indicate detection of cosmic rays, although this is not required.There may be additional circuitry that is not shown in FIG. 1 betweencosmic ray detector 26 and circuitry 24. Accordingly, the cosmic raydetection signal might change its form, state, or other characteristicbetween cosmic ray detector 26 and circuitry 24. As used herein, theterm “cosmic ray” is intended to be interpreted broadly to includevarious cosmic rays or particles that might change the voltage ofsignals in a chip.

In some embodiments, cosmic ray detector 26 indirectly detects a cosmicray by detecting the effect of an interaction of the cosmic ray with thechip or chip package, but does not directly detect the cosmic rayitself. In other embodiments, cosmic ray detector 26 directly detectsthe cosmic ray. In some embodiments, cosmic ray detector 26 can bothdirectly and indirectly detect a cosmic ray. It is expected that somedetected cosmic rays will cause a soft error, while other detectedcosmic rays will not cause a soft error. The cosmic ray detector 26 willnot know whether the cosmic ray actually causes a soft error. It is alsopossible that some cosmic ray detectors might sometimes mistakenlyidentify a cosmic ray, and create a cosmic ray detection signal inresponse to the mistaken identity.

Depending on the embodiment, there are various ways in which circuitry24 may respond to receiving a cosmic ray detection signal. For example,in some embodiments, circuitry 24 temporarily stops sending the outputsignals to conductors 28. Some or all of the signals internal tocircuitry 24 are discarded and at least some of the input signals areagain processed by circuitry 24. As explained below, in someembodiments, some internal signals are saved and reused rather thanbeing discarded. After the input signals are reprocessed, the resultingoutput signals are provided to conductors 28. Output signals may betemporarily stopped by preventing a clock signal from clocking theoutput signal. In some embodiments, conductors 28 are temporarily placedin a high impedance state (also called a tri-state state), although thisis not required.

In some embodiments, when a cosmic ray is detected, circuitry 24restarts at an earlier state. This is a new variant of speculativeexecution, where the speculation is that no soft errors will happen. Abit value or bits may record a cosmic ray event in the vicinity of alogical processing unit during an operation of the chip. For manyoperations, it is sufficient to record the fact that a signal or signalswere (potentially) subject to error, even after the operation isfinished and results are in use by another logical entity.

FIG. 2 provides an example of circuitry 24 of FIG. 1, although circuitry24 is not required to include these details. In the example of FIG. 2,circuitry 24 includes subcircuits SC1, SC2, and SC3. The subcircuits maybe any circuit from a very simple circuit up to a very extensive circuitinvolving millions of transistors. Subcircuit SC1 receives input signalsand performs some operation on them to create internal signals IS1.Subcircuit SC2 receives internal signals IS1 and in response theretocreates internal signals IS2. Subcircuit SC3 is output circuitry thatreceives internal signals IS2 and selectively provides them as outputsignals to conductors 28. Subcircuit SC3 is selectively prevented fromoutputting the output signals through an output control signal fromlogic 32 (for example, by preventing a clock signal from clocking theoutput signal). Subcircuit SC3 may be a simple logic gate or be morecomplicated. The subcircuits may receive input and output signals inaddition to those shown.

In operation, it is ordinarily the case that cosmic ray detector 26 doesnot detect cosmic rays and the cosmic ray detection signal is notapplied to logic 32 of circuitry 24. When the cosmic ray detectionsignal is not received, logic 32 does not cause subcircuit SC3 to blocksignals IS2 from passing to output conductors 28 because of a detectedcosmic ray (although there may be another reason why logic 32 mayprevent output signals). On the other hand, when the cosmic raydetection signal is received, logic 32 causes the output control signalto temporarily cause subcircuit SC3 to not pass internal signals IS2. Insome embodiments, subcircuit SC3 is not re-enabled until IS2 is properfor it to be output.

In FIG. 2, internal signals in subcircuits SC1 and SC2 may be discardedmerely by having them be changed as new inputs are applied.Alternatively, as shown in FIG. 3, logic 32 may provide discardingsignals to SC1 and SC2 to cause the internal signals to be discarded.

In some embodiments, logic 32 can also cause at least some of the inputsignals to be reapplied to circuitry 24 or to some of the subcircuits.This may cause circuitry 24 to operate on a previous state of signals.

In some embodiments, the input signals are stored in temporary storageand are reapplied to circuitry 24 from the temporary storage, althoughsuch temporary storage is not included in all embodiments. In someembodiments, some internal signals are also stored in temporary storagefor reuse. In these embodiments, the combination of certain inputsignals and internal signals may constitute the earlier state. As anexample, logic 32 can direct circuitry 24 to read from the temporarystorage.

FIG. 4 shows a chip 40 with temporary storage 48 as part of circuitry24. Temporary storage 48 may include registers, SRAM, DRAM, Flash, orother types of memory. FIG. 5 shows a chip 50 in which temporary storage48 is more removed from circuitry 24, but still in the same chip ascircuitry 24. An advantage to having the temporary storage be removedfrom circuitry 24 is that if a cosmic ray hits circuitry 24, it is lesslikely to also effect temporary storage 48 if temporary storage 48 isspatially separated from circuitry 24. FIG. 6 illustrates chips 60 thatincludes circuitry 24 and another chip 66 that holds temporary storage48. There may be additional circuitry that is not shown in FIG. 6 thatis between temporary storage 48 and circuitry 24.

As an example, FIG. 7 illustrates a chip 80 that includes circuitry 24that receives data and instructions from a cache 82. Cache 82 mayrepresent multiple caches. As shown in FIG. 7, circuitry 24 includesfetch circuitry 86, a pipeline 88, and logic 92, although these elementsare not required in all embodiments. In ordinary operation, fetchcircuitry 86 fetches instructions from cache 82. Pipeline 88 performs atleast some of the fetched instructions. Data from cache 82 can beprovided to pipeline 88 directly or through fetch circuitry 86. When acosmic ray is detected, a cosmic ray detection signal is received bylogic 92, which may be the same as or similar to logic 32 in FIG. 2. Inthe example of FIG. 7, logic 92 causes all or part of pipeline 88 to beflushed and temporarily prevents the outputting of data to conductors28. Logic 92 causes fetch circuitry 86 to re-fetch the instructions forpipeline 88. Pipeline 88 can also retrieve data from cache 82 as needed.In this way, if an error is introduced into some of the data orinstructions in pipeline 88 because of the cosmic ray, the instructionscan be re-executed along with the data.

FIG. 8 is similar to FIG. 7 except that chip 96 in FIG. 8 includestemporary storage 48 that holds data to be used by pipeline 88 in theevent of a cosmic ray detection. As pipeline 88 is processinginstructions and data, it may generate internal data that can be storedin temporary storage 48 and in some embodiments also in cache 82. When acosmic ray detection signal is detected by logic 92, logic 92 can causepipeline 88 to retrieve at least some of the data from temporary storage48 as needed. In some embodiments, some data from cache 82 can also bestored in temporary storage 48. In some embodiments, temporary storage48 also holds at least some instructions and data from cache 82. Theremay be error detection techniques used to see if data has errors, butthis is not required.

Of course, each of the chips shown or described may have various memorythat is not illustrated in the figures and that temporarily storesvarious data that might not be used in re-execution in response to acosmic ray detection. Some memory may hold some signals that are used inre-execution and other signals that are not used in re-execution.

FIG. 9 illustrates a chip 100 that includes circuitry C1, circuitry C2,and circuitry C3, with associated temporary storage TS1, TS2, and TS3.Circuitry C1 provides output signals Out1. Circuitry C2 and C3 haveinput signals which are Out1 and Out2 respectively, and output signalsOut2 and Out3 respectively. The circuitry may also have other inputsignals (see, for example, those shown being input into circuitry C2)and other output signals (not shown). Logic similar to logic 32 or 82may be included. Three cosmic ray detectors CRD1, CRD2, and CRD3 are indifferent locations. In some embodiments, CRD1 is closest to circuitryC1, CRD2 is closest to circuitry C2, and CRD3 is closest to circuitryC3.

In FIG. 10, chip 110 is similar to chip 100 of FIG. 9. One differencebetween chip 100 and chip 110 is that temporary storage TS1, TS2, andTS3 in chip 110 are combined in memory structure 116. By contrast, inFIG. 9, TS1, TS2, and TS3 are spatially separated. Another difference isthat in chip 110 each of CRD1, CRD2, and CRD3 provide a cosmic raydetection signal to each of the circuitry C1, C2, and C3. A reason to dothis is that some cosmic ray detectors detect a cosmic ray from anywhere in the chip or from a fairly large volume of the chip.Accordingly, more than one detector may detect a particular cosmic ray.It might not be clear which cosmic ray detector is closest to the cosmicray interaction. In this case, it may be safest to have all thecircuitry notified of the event. If the cosmic ray detectors detectinteractions that are only at or very close to the detectors, then itmight be appropriate to have each of CRD1, CRD2, and CRD3 provides acosmic ray detection signal to only one of the circuitries. Morecomplicated circuitry might be used to determine more precisely wherethe cosmic ray interaction happens. For example, some triangulation ortiming circuitry might be used, but that is not required. In FIG. 9, thecosmic ray detection signals are provided to all upstream circuitries.In FIG. 12, the cosmic ray detection signals are applied to only onecircuitry each.

Merely as an example, cache 82 in FIG. 8 may be C1 in FIG. 10 withtemporary storage 48 being included in memory 116. FIG. 8 could havedifferent temporary storages for cache 82 and pipeline 88 such as shownin FIG. 9.

FIG. 11 illustrates chips 120 and 128. Circuitry 24 provides an outputsignal to circuitry 134 of chip 128. In addition, circuitry 24selectively provides a cosmic ray event signal to cosmic ray responsecircuitry 130 of chip 128. The cosmic ray event signal indicates that acosmic ray has been detected and it may have led to potential error inthe output signal from circuitry 24. Cosmic ray response circuitry 130decides what to do about the potential error in the output signal fromchip 120. For example, in some embodiments, cosmic ray responsecircuitry 130 causes circuitry 134 to ignore the input signals and waitfor a new (reprocessed) output signals from chip 120. Circuitry 130 mayrequest chip 120 to reprocess and send another output signal. In otherembodiments, cosmic ray response circuitry 130 may allow circuitry 134to accept the input signals if various tests on the input signals aresuccessful and otherwise ignore the input signals and wait for new inputsignals.

Referring to FIG. 24, cosmic ray response circuitry 130 in FIG. 11 mayinclude error detecting and correcting circuitry 302 to detect errors inthe output signals and correct them. The errors may be the soft errorsor other errors caused by the soft errors. If there is no cosmic rayevent signal (or if it is not asserted), then the input signals (whichare output from chip 120) may pass through to circuitry 134. If there isa cosmic ray event signal, errors may be detected, if possible, andcorrected, if possible. Referring to FIG. 25, circuitry 24 and (thecircuitry) may include error detecting and correcting circuitry 306. Inthis respect, rather than reprocess signals, the response may be todetect and correct errors. Of course, in many cases, detecting and/orcorrecting the error might not be possible and reprocessing is theappropriate response to detecting a cosmic ray. Accordingly, in someembodiments, circuitry 24 and 130 do not have error detection or errorcorrection circuitry.

There may be additional circuitry (not shown) between circuitry 24 andcircuitry 134 and additional circuitry (not shown) between circuitry 24and cosmic ray response circuitry 130. Accordingly, the output signaland cosmic ray event signal may change form, state, or othercharacteristic. Further, the output signals and cosmic ray event signalsmay be time multiplexed or packetized on the same conductors in parallelor serial form.

FIG. 12 shows details of a chip 140 according to some embodiments of theinvention, but other embodiments do not include these details. Referringto FIG. 12, chip 140 is similar to chip 100 of FIG. 9. However, circuitC3 selectively provides a cosmic ray event signal on conductor(s) 148.The cosmic ray event signal indicates that a cosmic ray has beendetected in association with chip 140. Chip 140 also includesconductor(s) 144 which provides a cosmic ray event signal from circuitC1 to C2 and conductor(s) 146 which provides a cosmic ray event signalfrom circuit C2 to C3. In some embodiments, the cosmic ray event signalon conductor(s) 144 comes directly from conductor(s) 150 and in otherembodiments, it is indirect. In some embodiments, the cosmic ray eventsignal on conductor(s) 146 comes directly from conductor(s) 144 or 152and in other embodiments, it is indirect. In some embodiments, thecosmic ray event signal on conductor(s) 148 comes directly fromconductor(s) 146 or 154 and in other embodiments, it is indirect.

In different embodiments, the cosmic ray detectors may be placed indifferent positions. For example, FIG. 13 illustrates a chip with activesilicon region 170 on a substrate 172 (which may also be silicon). Thecosmic ray detectors CRD1 and CRD2 are formed into the active region ofthe silicon. In FIG. 14, cosmic ray detectors CRD1 and CRD2 are formedin a substrate 182, which supports an active silicon region 180. In FIG.15, cosmic ray detectors CRD1 and CRD2 are formed into a package 196supporting substrate 192 on which is formed an active silicon region180. The inventions are not restricted to these details. The chips ofFIGS. 13-19 and 21 may be flipped (for example, in a flipped-chiparrangement). In FIG. 15, the CRD1 and CRD2 may be put on the other sideof active silicon 180. This is, FIG. 15 could be changed so CRD1 andCRD2 are above active silicon 204 rather than below it as shown in FIG.15 (where “above” and “below” are not necessarily gravitationalorientations).

In some embodiments, there is only one cosmic ray detector for a chipand in other embodiments there may be more than one detector, includingmany detectors.

The cosmic ray detectors may be bigger or smaller than are shown in thefigures with respect to the relative size of the chip. Indeed, all thefigures are schematic in nature and not intended to show actual orrelative sizes of components in the figures.

In different embodiments, the cosmic ray detectors are at differentorientations with respect to the top and bottom surfaces of the chip.The cosmic ray detectors may be parallel with or perpendicular to thetop and bottom surfaces or they may be at other angles with respect tothem.

The chips described herein may be fabricated on silicon substrates or beother types of chips such as gallium arsenide chips. Various types offabrication processors may be used. As fabrication techniques evolve,the chips may have characteristics different than illustrated, yet theprinciples of the inventions will still apply.

B. Cosmic Ray Detectors

Various types of cosmic ray detectors may be used including those thatare currently available and those yet to be made. Current integratedcircuit chips have a top layer of silicon that contains all the activeelements and is perhaps only one micron in thickness. As we progressinto nanotechnology, the working thicknesses will likely drop. A cosmicray that causes soft errors may result in a silicon nucleus splittingapart and create a trial of ionizing debris over a track on the order ofa hundred microns long. The next energy released may be several millionelectron volts and the final products may be several millionelectron-hole pairs with a typical energy of several electron volts foreach particle. Various types of cosmic ray detectors may detect theseelectron-hold pairs.

In different embodiments, a cosmic ray detector may include electrical,optical, mechanical, or acoustic components, or a combination of one ormore of electrical, optical, mechanical, or acoustic components. In someembodiments, the cosmic ray detectors may include components that arenot electrical, optical, mechanical, or acoustic components.

In some embodiments, the cosmic ray detector detects the debris tract ofa cosmic ray. In some embodiments, the cosmic ray detector includeslarge, distributed P-N junctions to gather charge. In some embodiments,the cosmic ray detector includes optical cosmic ray detectors embeddedinto some optically clear supporting insulator such as diamond thermalspreaders. For example, one million electron-hole pairs may create alarge number of recombination photons. In some embodiments, ascintillator panel (which gives off small flashes of light (photons)when a charge particle passes through it), a light guide to direct lightfrom the scintillator, and photon detectors may be used.

In some embodiments, the cosmic ray detectors include an array ofmicro-electro-mechanical systems (MEMS). MEMS cosmic ray detectors maybe an integration of mechanical elements, sensors, actuators, andelectronics on a very small scale. The cosmic ray detectors may includetips or other strain detectors to detect the shockwave from the nuclearcollision by means of acoustic waves propagating through the substrate.

It is understood that when a cosmic ray fragments a silicon nucleus,about 10 Mev (mega electron volts) or 1 pJ (pico joules) of energy isreleased in less than 1 nanosecond. After the electrons and holesrecombine the net cosmic ray energy appears in the form of local heatingor a cloud of phonons spreading out from the impact site. Assumingrecombination happens within a nanosecond or so and given the speed ofphonons in a lattice of around 10 Km/sec (killometers/second), we seethat the cosmic ray has transformed into an intense sound wave with awavefront that may be on the order of 0.01 mm (millimeter) thick. At adistance of 5 mm from the source of the sound, this waveform may producea peak acoustic power density of 0.3 mW/cm⁻² (milliwatts/centimetersquared). Over an aperture of a wavelength squared, a peak power of 0.3nW (nanowatts) may be received. For the gigahertz bandwidth of thissignal (1/ns) (nanosecond) thermal noise may be about 10⁻¹¹ watts. Thus,there may be a very large signal to noise for this waveform. There maybe other sources of noise due to circuit switching but the signature ofthis form of heating should be very different. Note that actual thenumbers may vary in particular examples.

By incorporating a very sensitive strain cosmic ray detector into acantilever it is possible to build high speed acoustic cosmic raydetectors. One possibility is to incorporate a Scanning TunnelingMicroscope, STM, structure into a cantilever. STM structures can detectdisplacements as small as 1/10,000^(th) of an atomic diameter. In someembodiments, the cosmic ray detector includes a very small cantileverthat will not respond to slow acoustic waves. If the cantilever is onthe order of 0.01 mm long, then it may optimally respond to the abruptwaveform of the cosmic ray event. Much larger or smaller cantilevers maytend to ignore this size of disturbance. However, desirable lengths ofcantilevers may vary depending on various factors. The stiffness orother properties of the cantilever may effect a desirable length and maybe chosen to achieve desired movement. The first resonance or responsefrequency of the cantilever may be matched to the dominant frequenciesexpected from a cosmic ray. (Of course, in some embodiments, the cosmicray detectors does not include a cantilever.)

In some embodiments, the cosmic ray detector or detectors include one ormore MEMS structures that are tuned to the expected acoustic waveformfrom a cosmic ray event. STM structure tips can provide extremelysensitive strain detection of sound waves.

The entire event may release its energy in less than one nanosecond.Thus, a soft error bit or bits might be able to be set beforecalculation has progressed very far. The soft error bit or bits, ifused, may be in logic 32 and logic 82.

FIG. 16 illustrates a chip 202 with a cosmic ray detector 206 includinga cantilever 212, an STM structure tip 204 and a etched silicon tip 218.A cosmic ray fireball 220 represents an interaction between a cosmic rayand silicon in substrate 208 near active silicon 204. In response to theinteraction, a wave causes the distance between STM structure tip 214and tip 218 to change. This change is detected and interpreted as beingcaused by a cosmic ray. An optional amplifier 216 is shown betweencosmic ray detector 206 and active silicon 204. In practice, amplifier216 may be part of cosmic ray detector 206, part of active silicon 204,or between them. Amplifier 216 and cosmic ray fireball 220 are not shownin other figures to avoid clutter.

FIG. 17 illustrates a chip 222 that is like chip 202 in FIG. 16 exceptthat the chip is flipped in orientation so that cosmic ray detector 206is in a chamber 234 supported by a support 232.

FIG. 18 illustrates a chip 232 that is like chip 222 in FIG. 17 exceptthat the chamber 234 is closer to active silicon 204 than is shown inFIG. 17.

FIG. 19 illustrates a chip 242 and chamber 234 being in a package 246.Cosmic ray detector 206 may be put on the other side of active silicon204. This is, FIG. 19 could be changed so cosmic ray detector 206 isbelow active silicon 204 rather than above it as shown in FIG. 19 (where“above” and “below” are not necessarily gravitational orientations).

FIG. 20 illustrates a current measuring circuitry 250 which is includedin some embodiments of cosmic ray detector 206, but is not required inall embodiments. Current measuring circuitry 250 detects changes in thecurrent between tips 214 and 218, which can change as the distancebetween the tips change. In some embodiments, current measuringcircuitry 250 detects sudden changes in current and provides a signal toamplifier 216 in response thereto. In other embodiments, currentmeasuring circuitry 250 detects when the current goes above or belowcertain threshold amounts. Other possibilities exist.

FIG. 21 illustrates a chip 262 with a cosmic ray detector 270 with acantilever 274 and a strain gage 272. In response to a cosmic rayinteraction event, strain gage 272 bends. Bend detection circuitry 278determines whether a bend of strain gage 272 is of the type that wouldbe caused by a cosmic ray interaction event. There may also be anamplifier. Although bend detection circuitry 278 is illustrated insubstrate 266, it may be next to the cantilever, in active silicon 204or in substrate 266. Cosmic ray detector 270 may be in other places, forexample as shown in FIGS. 17-19.

FIGS. 22 and 23 illustrate chips 282 and 286 associated with cosmic raydetectors CRD1, CRD2, and CRD3. The cosmic ray detectors are smaller inFIG. 23 than in FIG. 22. The cosmic ray detectors may actually bigger orsmaller than shown relative to the size of the chip. If the detectorsare small enough, they may be economically placed in the active silicon.The cosmic ray detectors may be in, above, or below the active siliconor be in the package. As noted, some cosmic ray detectors can detectorcosmic interaction events from a significant distance from the cosmicray detector. More or less than four detectors may be used. The cosmicray detectors in FIGS. 22 and 23 may represent any of the cosmicdetectors described or illustrated including those having cantilevers,those having distributed P-N junctions to gather charge, and thosehaving photo-detectors.

In different embodiments, the cosmic ray detectors are at differentorientations with respect to the top and bottom surfaces of the chip.The cosmic ray detectors may be parallel with or perpendicular to thetop and bottom surfaces or they may be at other angles with respect tothem.

C. Additional Information

The various numbers and details provided above regarding cosmic rayinteractions and detections are believed to be correct, but may be onlyapproximate or mistaken for various reasons. However, the principles ofthe inventions will still apply.

In FIGS. 13-19 and 22, the active silicon region is illustrated as notgoing over the entire substrate. However, the active silicon regioncould extend over the entire substrate or over more or less than isshown in the figures.

The cosmic ray detectors could be wirelessly coupled to the chips.

If the term “first circuitry” is used in the claims, it does notnecessarily apply that there is secondary circuitry, although theremight be.

An embodiment is an implementation or example of the inventions.Reference in the specification to “an embodiment,” “one embodiment,”“some embodiments,” or “other embodiments” means that a particularfeature, structure, or characteristic described in connection with theembodiments is included in at least some embodiments, but notnecessarily all embodiments, of the inventions. The various appearancesof “an embodiment,” “one embodiment,” or “some embodiments” are notnecessarily all referring to the same embodiments.

If the specification states a component, feature, structure, orcharacteristic “may”, “might”, or “could” be included, that particularcomponent, feature, structure, or characteristic is not required to beincluded. If the specification or claim refers to “a” or “an” element,that does not mean there is only one of the element. If thespecification or claims refer to “an additional” element, that does notpreclude there being more than one of the additional element.

The inventions are not restricted to the particular details describedherein. Indeed, many other variations of the foregoing description anddrawings may be made within the scope of the present inventions.Accordingly, it is the following claims including any amendments theretothat define the scope of the inventions.

1. A system comprising: a cosmic ray detector to detect cosmic rays andto generate cosmic ray detection signals indicative of the detectedcosmic rays; and first circuitry to receive input signals and to produceoutput signals, and wherein the first circuitry speculates that thecosmic ray detector will not detect cosmic rays, but in response to thecosmic ray detection signals, the first circuitry re-performs at leastsome operations.
 2. The system of claim 1, wherein in response to thecosmic ray detection signals, the first circuitry discards some signalsinternally generated by the first circuitry.
 3. The system of claim 1,wherein to reproduce the output signals, the first circuitry alsoreceives intermediate data signals that were previously produced by thefirst circuitry.
 4. The system of claim 1, further including temporarystorage to hold intermediate data signals produced by the firstcircuitry.
 5. The system of claim 4, wherein the temporary storage alsoholds instructions to be performed by the first circuitry.
 6. The systemof claim 5, wherein the first circuitry is on a chip and the temporarystorage is on the same chip as the first circuitry.
 7. The system ofclaim 5, wherein the first circuitry is on a chip and the temporarystorage is on a different chip.
 8. The system of claim 1, wherein thecosmic ray detectors are in a substrate that supports an active regionthat includes the first circuitry.
 9. The system of claim 1, wherein thecosmic ray detector is a first cosmic ray detector and wherein thesystem further comprises second circuitry and a second cosmic raydetector to provide cosmic ray detection signals to the secondcircuitry.
 10. The system of claim 9, wherein the first and secondcircuitry each receive the first and second cosmic ray detectionsignals.
 11. The system of claim 1, wherein the first circuitry is in afirst chip and wherein the system further comprises a second chip withcosmic ray response circuitry to receive a cosmic ray event signalindicating the detection of a cosmic ray.
 12. The system of claim 11,wherein the cosmic ray response circuitry requests the first circuitryto regenerate the signals to the second circuitry.
 13. The system ofclaim 1, wherein the cosmic rays are detected indirectly through thedetection of effects of an interaction of the cosmic ray and a chipcontaining the first circuitry.
 14. A system comprising: a cosmic raydetector to detect cosmic ray and to generate cosmic ray detectionsignals indicative of the detected cosmic rays; and first circuitry toreceive input signals and produce output signals in response thereto,and wherein, in response to the cosmic ray detection signals, the firstcircuitry re-receives at least some of the input signals and reproducesthe output signals.
 15. The system of claim 14, wherein in response tothe cosmic ray detection signals, the first circuitry discards somesignals internally generated by the first circuitry.
 16. The system ofclaim 14, wherein to reproduce the output signals, the first circuitryalso receives intermediate data signals that were previously produced bythe first circuitry.
 17. The system of claim 14, further includingtemporary storage to hold intermediate data signals produced by thefirst circuitry.
 18. The system of claim 17, wherein the temporarystorage also holds instructions to be performed by the first circuitry.19. The system of claim 18, wherein the first circuitry is on a chip andthe temporary storage is on the same chip as the first circuitry.
 20. Asystem comprising: a cosmic ray detector to detect cosmic ray and togenerate cosmic ray detection signals indicative of the detected cosmicrays; and first circuitry to receive input signals and produce internalsignals and deliver them as output signals, and wherein, in response tothe cosmic ray detection signals, the first circuitry prevents at leastsome of the produced internal signals from being delivered as outputsignals.
 21. The system of claim 20, wherein the first circuitryproduces internal signals and deliver them as output signals,
 22. Thesystem of claim 20, wherein the cosmic ray detection signals have afirst state to indicative that cosmic rays have not been detected and asecond state to indicated that cosmic ray signals have been detected.23. The system of claim 20, further comprising temporary storage. 24.The system of claim 20, further comprising a first chip and a packagefor the first chip, wherein the first chip includes an-active siliconportion and a substrate, and wherein the first circuitry is in the firstchips a chip.
 25. The system of claim 24, wherein the cosmic raydetector is in an active region that includes the first chip.
 26. Thesystem of claim 24, wherein the cosmic ray detector is in the substrate.27. The system of claim 24, wherein the cosmic ray detector is in thepackage.
 28. A system comprising: a first chip including: cosmic rayresponse circuitry to receive a cosmic ray event signal; and firstcircuitry to receive input signals and to produce output signals, andwherein the first circuitry speculates that a cosmic ray will not bedetected, but in response to a cosmic ray event signal, the cosmic rayresponse circuitry causes the first circuitry to ignore the inputsignals and to re-receive the input signals.
 29. The system of claim 28,wherein the cosmic ray response circuitry causes the first circuitry toignore the input signals and to re-receive the input signals only iferrors in the input signals are detected and cannot be corrected. 30.The system of claim 28, further comprising a cosmic ray detectorassociated with the first chip.
 31. The system of claim 28, wherein thecosmic ray response circuitry requests another chip to resend the inputsignals.
 32. A system comprising: a cosmic ray detector to detect cosmicrays and to generate cosmic ray detection signals indicative of thedetected cosmic rays; and first circuitry to receive input signals andto produce output signals, and wherein in response to the cosmic raydetection signals, the first circuitry attempts to detect and correctany errors caused by the cosmic rays.
 33. The system of claim 32,wherein the cosmic ray detectors are in a substrate that supports anactive region that includes the first circuitry.
 34. The system of claim32, wherein the errors include soft errors and other errors caused bythe soft errors.
 35. The system of claim 32, wherein the cosmic raydetector is a first cosmic ray detector and wherein the system furthercomprises second circuitry and a second cosmic ray detector to providecosmic ray detection signals to the second circuitry.